Basic information:Plasma-enhanced atomic Layer Deposition System (ALD)

Version:MNT-P-100-43

Manufacturer: Wuxi Meinard Micro and Nano Technology Co. LTD

Main technical parameters:

Substrate specification RT-400℃, control accuracy±0.5℃ @ single cavity.

Application：

Atomic layer deposition (ALD) is a self-limiting, surface-controlled chemical vapor deposition method. The films prepared by ALD have excellent uniformity, shape retention, no defects and pinholes, which are especially suitable for the deposition of some ultra-high depth/width ratio grooves and three-dimensional materials with complex structures.